Quad-Flat-No-Lead Packaging Market Trends, Active Key Players, and Growth Projection Up to 2031

Quad-Flat-No-Lead Packaging Market Expected to Reach $1.1 Billion by 2031 — Allied Market Research

WILMINGTON, DELAWARE, UNITED STATES, July 11, 2024 /EINPresswire.com/ -- Usage of quad-flat-no-lead packaging technology is increasing in consumer electronics and semiconductor packaging. The advantages of the QFN packages' cost and performance, as well as their proximity to the boards, make them particularly interesting for radio frequency (RF) applications. Allied Market Research, titled, "Quad-Flat-No-Lead Packaging Market," The quad-flat-no-lead packaging market size was valued at $453.10 million in 2021, and is estimated to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.

𝐑𝐞𝐪𝐮𝐞𝐬𝐭 𝐟𝐨𝐫 𝐒𝐚𝐦𝐩𝐥𝐞 𝐏𝐃𝐅: https://www.alliedmarketresearch.com/request-sample/A31393

The quad flat-no-lead (QFN) is a leadless packaging with exposed die pads for mechanical and thermal integrity. It also has peripheral terminal pads. The container may be either rectangular or square. The QFN package could be utilized in a variety of applications. QFN packaging is appropriate for applications that require low standoff heights, decreased footprint, increased thermal performance, or reduced weight. This bundle can greatly benefit portable electronic devices, cell phones, and other devices.

The thermal cycle stress that a quad-flat-no-lead component might endure throughout its operating life is a more difficult thermal problem. Multiple package design improvements have increased in solder joint failure in electronic devices. Lead elimination reduces total joint compliance. As package sizes reduce, more silicon and less plastic are used, increasing the mismatch in coefficients of thermal expansion (CTE) between the item and the printed circuit board.

Consumer electronics are driving the trends for electronic packaging technologies toward size reduction and enhancing functionality. The rapid development and widespread use of QFA packaging used in consumer electronics started a new era in the electronics industry based on microelectronic technology, in which electronic goods become digital, smaller, and more intelligent. The trend in microelectronics has been toward ever-expanding I/Os on packages, which is influencing semiconductor packaging architecture. Smaller sizes, lighter weights, low total production costs, simpler assembly procedures, and enhanced electrical performance are all benefits of QFN packages. Due to these benefits, QFN has already become widely used in the business sector. These factors are anticipated to boost quad-flat-no-lead packaging market growth in the upcoming years.

The global quad-flat-no-lead packaging market share is segmented based on type, molding method, terminal pads, industry verticals, and region. By type, it is classified into the air-cavity QFN, plastic-moulded QFN, and others. By molding method, it is classified into punched and sawn. Terminal pads, it is classified into fully exposed terminal ends, pull-back terminal ends, and side wettable flank terminals. By industry vertical, it is classified into consumer electronics, industrial, automotive, computing/networking, and communications. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

𝐆𝐞𝐭 𝐚 𝐂𝐮𝐬𝐭𝐨𝐦𝐢𝐳𝐞𝐝 𝐑𝐞𝐬𝐞𝐚𝐫𝐜𝐡 𝐑𝐞𝐩𝐨𝐫𝐭 @ https://www.alliedmarketresearch.com/request-for-customization/A31393

The key players profiled in the quad-flat-no-lead packaging market report include 𝑨𝒎𝒌𝒐𝒓 𝑻𝒆𝒄𝒉𝒏𝒐𝒍𝒐𝒈𝒚, 𝑰𝒏𝒄., 𝑻𝒆𝒙𝒂𝒔 𝑰𝒏𝒔𝒕𝒓𝒖𝒎𝒆𝒏𝒕𝒔 𝑰𝒏𝒄𝒐𝒓𝒑𝒐𝒓𝒂𝒕𝒆𝒅, 𝑴𝒊𝒄𝒓𝒐𝒄𝒉𝒊𝒑 𝑻𝒆𝒄𝒉𝒏𝒐𝒍𝒐𝒈𝒚 𝑰𝒏𝒄., 𝑺𝑻𝑨𝑻𝑺 𝑪𝒉𝒊𝒑𝑷𝑨𝑪 𝑷𝒕𝒆 𝑳𝒕𝒅, 𝑨𝑺𝑬, 𝑵𝑿𝑷 𝑺𝒆𝒎𝒊𝒄𝒐𝒏𝒅𝒖𝒄𝒕𝒐𝒓𝒔, 𝑱𝑪𝑬𝑻 𝑮𝒓𝒐𝒖𝒑, 𝑷𝒐𝒘𝒆𝒓𝒕𝒆𝒄𝒉 𝑻𝒆𝒄𝒉𝒏𝒐𝒍𝒐𝒈𝒚 𝑰𝒏𝒄., 𝑻𝒊𝒂𝒏𝒔𝒉𝒖𝒊 𝑯𝒖𝒂𝒕𝒊𝒂𝒏 𝑻𝒆𝒄𝒉𝒏𝒐𝒍𝒐𝒈𝒚 𝑪𝒐., 𝑳𝒕𝒅, 𝑪𝒉𝒊𝒑𝑴𝑶𝑺 𝑻𝑬𝑪𝑯𝑵𝑶𝑳𝑶𝑮𝑰𝑬𝑺 𝑰𝑵𝑪.

The report offers a comprehensive analysis of the global quad-flat-no-lead packaging market trends by thoroughly studying different aspects of the market including major segments, market statistics, market dynamics, regional market outlook, investment opportunities, and top players working towards the growth of the market. The report also sheds light on the present scenario and upcoming trends & developments that are contributing to the growth of the market. Moreover, restraints and challenges that hold power to obstruct the market growth are also profiled in the report along with Porter's five forces analysis of the market to elucidate factors such as competitive landscape, bargaining power of buyers and suppliers, threats of new players, and the emergence of substitutes in the market.

𝐈𝐦𝐩𝐚𝐜𝐭 𝐨𝐟 𝐂𝐨𝐯𝐢𝐝-𝟏𝟗 𝐨𝐧 𝐭𝐡𝐞 𝐆𝐥𝐨𝐛𝐚𝐥 𝐐𝐮𝐚𝐝-𝐅𝐥𝐚𝐭-𝐍𝐨-𝐋𝐞𝐚𝐝 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐈𝐧𝐝𝐮𝐬𝐭𝐫𝐲

• COVID-19 impacted almost all industries and the electronics and semiconductor manufacturing companies stopped their operations owing to import-export restrictions, lockdown imposed across several countries, and a shortage of labor; the fear of contracting the novel coronavirus led to a decrease in demand in the market.
• Social distancing norms closed borders, and production constraints, due to the pandemic, across various countries such as China, India, and the U.S. have affected the global market.
• The emergence of the COVID-19 pandemic negatively affected the quad-flat-no-lead packaging market. The automotive industry was badly affected during the COVID-19 pandemic due to social distancing norms, import-export restrictions, and availability of raw materials which resulted in a reduction in demand for quad-flat-no-lead packaging as it is widely used in automobile components.
• Due to the COVID-19 pandemic demand for QFN from the semiconductor manufacturing sector decreased, due to various governments throughout the world instituted limitations including lockdowns and social distancing rules, which influenced the semiconductor industry's ability to produce semiconductors. As a result, demand for quad-flat-no-lead technology decreased.

𝐊𝐞𝐲 𝐅𝐢𝐧𝐝𝐢𝐧𝐠𝐬 𝐨𝐟 𝐭𝐡𝐞 𝐒𝐭𝐮𝐝𝐲

• Based on type, the air-cavity QFN sub-segment emerged as the global leader in 2021 and the fastest-growing sub-segment during the forecast period
• Based on the molding method, the punched sub-segment emerged as the global leader in 2021, and the sawn sub-segment is predicted to show the fastest growth in the upcoming years
• Based on the terminal pads, the fully exposed terminal ends sub-segment emerged as the global leader and fastest growing sub-segment during the forecast period
• Based on industry vertical, the automotive sub-segment emerged as the global leader and fastest-growing sub-segment during the forecast period
• Based on region, the Asia-Pacific market registered the highest market share in 2021 and is projected to maintain the position during the forecast period.
• The report also provides in-depth Quad-Flat-No-Lead Packaging Market Analysis

𝐄𝐧𝐪𝐮𝐢𝐫𝐲 𝐁𝐞𝐟𝐨𝐫𝐞 𝐁𝐮𝐲𝐢𝐧𝐠: https://www.alliedmarketresearch.com/purchase-enquiry/A31393

𝐀𝐛𝐨𝐮𝐭 𝐔𝐬:

Allied Market Research is a top provider of market intelligence that offers reports from leading technology publishers. Our in-depth market assessments in our research reports consider significant technological advancements in the sector. In addition to other areas of expertise, AMR focuses on analyzing high-tech and advanced production systems. We have a team of experts who compile thorough research reports and actively advise leading businesses to enhance their current procedures. Our experts have a wealth of knowledge on the topics they cover. Also, they use a variety of tools and techniques when gathering and analyzing data, including patented data sources.

David Correa
Allied Market Research
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